About Me


I am a postdoctoral scholar — UCSD CSE fellow working with Nadia Heninger and Deian Stefan. I received my PhD in ECE and MSc in CS from WPI under the supervision of Berk Sunar and Thomas Eisenbarth. I work on computer security and privacy; microarchitectural security, side channels and cryptanalysis, and architectural security primitives. I have also interned at Cisco Talos working on fuzz testing for automated vulnerability discovery and Qualcomm product security initiative (QPSI) working on system-level security of PCIe controllers.

Contact Information:
            


Selected Publications:

  1. D Moghimi, J Van Bulck, N Heninger, F Piessens, B Sunar. "CopyCat: Controlled Instruction-Level Attacks on Enclaves"  USENIX Security 2020.
  2. D Moghimi, M Lipp, B Sunar, M Schwarz. "Medusa: Microarchitectural Data Leakage via Automated Attack Synthesis" USENIX Security 2020.
  3. J Van Bulck, D Moghimi, M Schwarz, M Lipp, M Minkin, D Genkin, Y Yarom, B Sunar, D Gruss, F Piessens."LVI: Hijacking Transient Execution through Microarchitectural Load Value Injection" IEEE S&P 2020.
  4. D Moghimi, B Sunar, T Eisenbarth, N Heninger. "TPM-Fail: TPM meets Timing and Lattice Attacks"  USENIX Security 2020.
  5. M Schwarz, M Lipp, D Moghimi, J Van Bulck, J Stecklina, T Prescher, D Gruss. "ZombieLoad: Cross-Privilege-Boundary Data Sampling" ACM CCS 2019.
  6. A Moghimi, G Irazoqui, T Eisenbarth. "CacheZoom: How SGX Amplifies The Power of Cache Attacks"  IACR CHES 2017.

For a full list of my academic publications, check this out.


Services:

  • Organizer: Workshop on Attacks on Cryptography (WAC 4)
  • Program Committe: ACM ASHES 2020, IAW-IACR SPACE 2021, ACM ASHES 2021, IACR TCHES 2022, Usenix Security 2022
  • Journal/External Reviewer: IFIP/IEEE VLSI-SoC 2017, IACR Asiacrypt 2017, IACR TCHES 2018, IEEE TIFS 2018, IACR Kangacrypt 2018, DATE 2019, IJIS 2019, IACR Eurocrypt 2020, ACM JETC 2020, IEEE TIFS 2020, ACM DTRAP 2020, IEEE TDSC 2020, ACM CCS 2021, ACM DTRAP 2021, ACM CSUR 2021
  • Shadow Program Committe: IEEE S&P 2017 and 2019


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